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By using a dedicated chamber for rinsing and drying, precise cleaning is possible.
The cassette is set in the loader, and the substrate is transported using a chemical-resistant clean robot. Chemical processing is performed in Chamber A, rinsing in Chamber B, followed by spin drying, and then the substrate is stored in the cassette set in the unloader. This is a single-wafer automatic multi-spin processor.
By combining spin and spray, we achieved a high-precision and uniform process.
The WET process device Multi-Spin Processor performs developing/etching/drying processes on substrates using a spray method. The WET device technology from Denshi Giken Co., Ltd., including cleaning and other spin processes, can meet the needs of a wide range of industries such as semiconductors, LCD, medical, and food industries, starting with wafers and glass substrates, as well as cleaning printed circuit boards and metal substrates for various applications. 【Features】 - Achieves high precision and uniform processes through the combination of spin and spray - Transport by double-hand robot - Parallel processing of developing/etching/drying processes - Equipped with cup cleaning function - Realizes quick drying with N2 blow and high-speed spin rotation For more details, please contact us or download the catalog.
By using a dedicated chamber for rinsing and drying, precise cleaning is possible.
Set the cassette in the loader and transport the substrate using a chemical-resistant clean robot. Chemical processing is done in Chamber A, rinsing in Chamber B, followed by spin drying, and then the processed cassette is stored in the unloader. This is a single-wafer automatic multi-spin processor.
